1. For precision flat cutting of semiconductor wafers, crystals, circuit boards, fasteners, metals and other specimens.
2. The automatic cutting function ensures consistent sample quality and reduces operator fatigue from manual operation.
3. Fitted with a transparent cutting chamber for direct visual monitoring of the cutting process and improved operational safety.
4. Supports direct cutting and impact cutting modes to accommodate different material types and process requirements.
5. Equipped with a cooling water pump to cool and clean during cutting, protecting both specimens and cutting blades.